Description
⚡ Bond smarter, not harder — the future of conductive silicone is here!
- VERSATILE USE - Medium paste consistency works on overhead and vertical surfaces without sagging.
- DURABLE FLEXIBLE - Moisture-cure silicone creates a non-corrosive, minimal-shrinkage bond that lasts under varied conditions.
- ECO CONSCIOUS CHOICE - No volatile organic compounds (VOCs) ensure a safer, greener workspace.
- SUPERIOR CONDUCTIVITY - Silver-plated copper fill delivers a low 0.050 ohm-cm resistance for reliable electrical bonding.
- EFFORTLESS APPLICATION - One-component formula means zero weighing or mixing—just apply and go.
CHO-BOND 1030 is a one-component, silver-plated copper filled conductive silicone designed for flexible, strong electrical bonds with excellent conductivity (0.050 ohm-cm). It cures moisture-activated with minimal shrinkage, contains no VOCs, and works on vertical or overhead surfaces, making it ideal for EMI gasket bonding and electronic enclosure sealing in commercial and military applications.
