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3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

Name: 3D BGA Reballing Stencil Kit For Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net
Brand: Hhwj
Price: 180.19 PAB
Availability: InStock

Product ID: 155816460

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Frequently Bought Together

Description

Particle Size:1-10Μm
Usage:Repair For Iphone X
›See more product details

Particle Size:1-10ΜmUsage:Repair For Iphone X

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TrustScore 4.5 | 7,300+ reviews

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Excellent communication throughout the order process. Product is perfect.

2 weeks ago

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Great experience from order to delivery. Highly recommended!

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B/.180

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TrustScore 4.5 | 7,300+ reviews

Anjali K.

The product quality is outstanding. Exactly what I needed for my work.

1 month ago

Reema J.

Perfect platform for hard-to-find items. Delivery was prompt.

1 month ago

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